News & Events

Scholarships to Study in Japan
Seton Hall > News & Events 

Tuesday, March 17, 2009
by: Nandor Forgach

REMINDER: Deadline April 6, 2009  

The Bridging Scholarship program will award up to 50 scholarships to American students participating in study-abroad programs in Japan that begin in Fall 2009. Undergraduate students majoring in any field of study and attending any recognized exchange or independent program in Japan are eligible to apply for these scholarships.
 
Recipients of Bridging Scholarships will receive stipends ranging from $2,500 to $4,000, depending on the length of their study program in Japan. The scholarships are funded by donations from U.S. corporations and foundations to the US-Japan Bridging Foundation. Since 1999, the Bridging Scholarship program has awarded 875 scholarships to students studying abroad in Japan. Most recently, 17 students from colleges and universities received scholarships for the Spring 2009 semester.
 
The deadline for applications is April 6, 2009. Applicants will be notified of the results by May 30. Selection will be based on academic potential and financial need. The scholarships are administered by the Association of Teachers of Japanese.
 
In addition, Morgan Stanley will award two $7,500 scholarships to undergraduate students who will be studying abroad in Japan during the 2009-2010 academic year and who have an interest in economics and international finance. Applicants must submit an essay on one of several designated public-policy topics together with an application for the Bridging Scholarship program.
 
Fall 2009 programs are those beginning between August and October 2009 and continuing for at least three months. (Summer program participants are not eligible for Bridging Scholarships.) Students planning to study abroad in Japan beginning after January 1, 2010, should apply in October 2009 for the Spring 2010 scholarships.
 
Information on the Bridging and Morgan Stanley scholarships and downloadable application forms are available at ATJ's Web site. Printed application brochures are also available.
 

For more information please contact:
Nandor Forgach
(973)761-9072
oip@shu.edu